Clarkson University’s Center for Advanced Materials Processing (CAMP) will host the 26th International Symposium on Chemical Mechanical Planarization (CMP) in Lake Placid, NY, from August 11 – 14, 2024.
Chemical-mechanical planarization (CMP) plays a central role in many industrially important technologies, especially in semiconductor manufacturing. The 26th International Symposium on CMP will be a leading forum to hear leading-edge ideas and technologies relating to CMP along with ample time to network with colleagues in the CMP field. Presentations are by invitation only which ensures a very high-quality meeting.
Plan to join us in Lake Placid in August!
The symposium will be held at the High Peaks Resort in Lake Placid.
Check this website regularly for updates (new speakers, keynotes, plenaries, etc.)
Contact the CAMP office if you have any questions:
Telephone: +1-315-268-2336
Email: camp@clarkson.edu
Registration:
Regular Attendee: $900
Invited Speakers: $650
Students: $250
Registration includes breakfasts, lunches, and symposium dinner on Tuesday night (Aug 13), but not hotel accommodation or dinners on Sunday (Aug 11) or Monday (Aug 12) nights – please enjoy the restaurants along Lake Placid’s main street.
How to get to Lake Placid?
The following website has information on how to get to Lake Placid:
(https://www.lakeplacid.com/explore/getting-here)
While there is a small regional airport close by that has flights to/from Boston, planes are small and can be bumpy 🙁
The closest international airport is Albany NY (the NY State capitol). If you choose to fly into Albany, rent a car and then enjoy the 2.5 hour drive through the picturesque Adirondacks.