Clarkson University’s Center for Advanced Materials Processing (CAMP) hosted the 26th International Symposium on Chemical Mechanical Planarization (CMP) in Lake Placid, NY, from August 11 – 14, 2024.
Chemical-mechanical planarization (CMP) plays a central role in many industrially important technologies, especially in semiconductor manufacturing. The 26th International Symposium on CMP is a leading forum to hear leading-edge ideas and technologies relating to CMP along with ample time to network with colleagues in the CMP field. Presentations are by invitation only which ensures a very high-quality meeting.
FINAL Schedule Available! See below...
The symposium featured the following special guest speakers:
Vidya Krishnan
Vice President of Global Operations at GlobalFoundries
Keynote Speaker during conference dinner (Aug. 13)
“Operational Journey Through Time: How Digitization has Transformed Manufacturing Operations”
Ji-Chul Yang
General Manager & Head of R&D at EBARA Corp.
Plenary Speaker
“Images of the Planarization Process in Semiconductor Devices in 2030”
Brown Peethala
Senior Manager, CMP Process at IBM
Plenary Speaker
“Process Innovations for Advanced Logic Technology”
Some photos from the symposium:
*** Updated FINAL Schedule & Abstract Booklet Available ***
The final schedule and abstract booklet for the 2024 CAMP CMP Symposium is available as a PDF.
Please note this version is as of 8 August 2024 but is subject to change.
Please contact Leila Boyea if you need the agenda emailed to you.
Invited Speakers:
Uma Rames Krishna Lagudu (3M)
“Pad Conditioning Solutions for Improved Pad Life and Defectivity”
Kangchun Lee (Kyonggi University)
“Predicting Corrosion Inhibition Efficiency Based on Charge Transfer Factor”
Leticia Vazquez Bengochea (Micron)
“How CMP Will Enable and Accelerate the Advanced Memory Roadmap”
Syuhei Kurokawa (Kyushu University)
“Observation of slurry particle behavior at the polishing pad-wafer contact interface and proposal of a new pad-wafer contact model for understanding CMP mechanism”
Norikazu Suzuki (Chuo University)
“Towards an Advanced Process Control of Chemical Mechanical Polishing Utilizing Physical Model-based Digital Twin”
Yohei Hashimoto (Kanazawa University)
“Analysis of Material Removal Rate Distribution in Oxide CMP Process Using Stop-polishing Approach”
Hideo Aida (Nagaoka Univ. of Technology)
“Development of Plasma-CMP Technique for Hard-to-process Semiconductor Materials”
Yasuhiro Kawase (Mitsubishi Chemical Corp.)
“Semiconductor Cleaning: Fundamentals and Technology Trends in Post-CMP Cleaning”
Seokgyu Ryu (Clarkson University)
“Advancing Molybdenum CMP: Understanding Inhibition Mechanism of Environmentally Friendly Amino Acids via Passivation Layer Analysis”
John Matovu (Micron)
“Challenges and Opportunities of Using Engineered High Oxide Rate Slurries (HORS) for Scratch Reduction and Removal Rate Improvement”
Jakub Nalaskowski (NYCREATES)
“Chemical Mechanical Planarization for Superconducting Quantum Devices Development”
Seunghoon Choi (Samsung)
“Tailored Electrostatic Attraction Force Between Anionic Polymer and Si3N4 Film in Consecutive Gate Poly Open CMP”
Myunggoo Lee (KCTech)
“Surface chemistry of Ceria for CMP”
Ravi Palaparthi (DuPont)
“Wafer Edge Profile and Control during CMP”
Yi Guo (DuPont)
“Exploration of Tungsten and MOL Slurry Building-Blocks for Advanced Node CMP Processes”
Pinlei Chu (IBM)
“Tungsten dissolution in MOL-Root Cause Investigation”
Dan Troolin (TSI)
“High-Resolution Size Distribution Characterization of CMP Slurry Particles”
Badri Bhattarai (EMD Group)
“Copper CMP Slurry Development for Advanced Technology Nodes”
Hanchul Cho, Doyeon Kim, Taekyung Lee, Hyoungjae Kim (Korea Institute of Industrial Technology)
“Breaking Boundaries: Recipe-Free Innovation in CMP Pad Conditioning”
Cetin Cetinkaya (Clarkson University)
“Nano/Micro-Particle Adhesion and Removal“
Atanu Das (Entegris)
“Integrated Approaches of Designing Better PCMP Cleaning Formulations”
Taesung Kim (SKKU)
“Investigation of Thermal Effects in Chemical Mechanical Planarization (CMP)”
Christoper Netzband (TEL)
“Planarization Challenges for Current and Future 3D Integration Technologies”
Rob Rhoades (XTrinSiC)
“Methods for Characterizing Slurry Health and Why it Matters”
Francois Laforge (Horiba)
“Simultaneous Live Monitoring of Multiple Additives Concentration with a Flow Cell Raman Spectroscopy System“
Jason Keleher (Lewis University)
““Stimuli-Responsive” Chemistries for Low-Stress SiC p-CMP Cleaning Processes“
Sunghoon Lee (KCTech)
“The Future of Ceria Slurry: Selectivity, Planarization and Defect“
Please note that oral presentations are by invitation only.
Master Schedule
Below is an outline of the symposium schedule.
Each Session will consist of 4-5 talks (most 25 mins except the two plenaries and the keynote). Topics include: CMP Applications, CMP Pads and Conditioners, CMP Slurries, Post-CMP Cleaning, Advances in CMP Tools, CMP of Novel Materials.
SUNDAY, AUGUST 11
1:00 pm – 5:00 pm Registration & Hotel Check-In (Hotel Lobby)
5:00 pm – 6:00 pm Welcome Reception (Sentinel Range)
MONDAY, AUGUST 12 All presentations will be held in McIntyre Range
7:00 am – 8:00 am Breakfast (Great Range)
8:00 am – 9:50 am SESSION A: (Includes Plenary Speaker 1)
9:50 am – 10:15 am Break (25 min)
10:15 am – 12:00 am SESSION B:
12:00 pm – 1:30 pm Lunch (Great Range)
1:30 pm – 4:00 pm Open Time
4:00 pm – 5:30 pm SESSION C:
5:40 pm – 7:00 pm Poster Session and Reception (Sentinel Range)
7:00 pm – late Dinner on your own. There are many excellent restaurants in Lake Placid to choose from.
TUESDAY, AUGUST 13
7:00 am – 8:10 am Breakfast Buffet (Great Range)
8:10 am – 9:50 am SESSION D: (Includes Plenary Speaker 2)
9:50 am – 10:15 am Break (25 min)
10:15 am – 12:00 pm SESSION E: Title
12:00 pm – 1:30 pm Lunch (Great Range)
1:30 pm – 4:00 pm Open Time
2:00 pm – 4:00 pm Panel for Students: From Rough to Ready: Protecting Your CMP Innovations
Through IP, Led by Tricia Burroughs, GlobalFoundries (optional)
4:00 pm – 5:40 pm SESSION F:
5:40 pm – 6:30 pm Reception (Sentinel Range)
6:30 pm – 8:30 pm 2024 International CMP Symposium: Dinner & Keynote Address (Great Range).
Vidya Krishnan, VP for Global Operations, GlobalFoundries.
WEDNESDAY, AUGUST 14
7:00 am – 8:30 am Breakfast Buffet
SESSION G: Session Title
8:10 am – 9:50 am SESSION G:
9:50 am – 10:15 am Break (25 min)
10:15 am – 12:30 pm SESSION H:
12:30 pm – 1:30 pm Lunch (Great Range) & Depart
Student Posters
We have a student poster session on Monday afternoon of the 26th International Symposium on Chemical-Mechanical Planarization.
The goal of the poster session is to provide an opportunity to network, learn about each other’s work and interests, and meet academic and industrial colleagues for future collaborative research.
How to get to Lake Placid?
The following website has information on how to get to Lake Placid:
(https://www.lakeplacid.com/explore/getting-here)
While there is a small regional airport close by that has flights to/from Boston, planes are small and can be bumpy 🙁
The closest international airport is Albany NY (the NY State capitol). If you choose to fly into Albany, rent a car and then enjoy the 2.5 hour drive through the picturesque Adirondacks.